CN/EN

产物与市场

SF230

特色

●  较低的介电消耗,插损靠近LCP。

●  优异的耐热性、尺寸不变性、耐化学性及电机能。

●  不含卤素,阻燃性到达UL94 VTM-0级。

●  知足RoHS指令请求,不含铅、汞、镉、六价铬、多溴联苯、多溴联苯醚等。

利用范畴

高速电路用挠性印制板和刚挠性印制板
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Items Method Condition Unit Typical Value
Peel Strength (90°) IPC-TM-650 2.4.9D Accepted N/mm 1.36
288℃, 5s 1.47
Solder Resistance IPC-TM-650 2.4.13.F 288℃, 10s - No delamination
Dimensional Stability IPC-TM-650 2.2.4B After Etched
% 0.0149/-0.0360
Chemical Resistance IPC-TM-650 2.3.2G After Chemical Exposure % >95
Electric Strength IPC-TM-650 2.5.6.2A D-48/50+D-0.5/23 KV/mm 200
Volume Resistivity IPC-TM-650 2.5.17E C-96/35/90 MΩ-cm 1.2×109
Surface Resistance IPC-TM-650 2.5.17E C-96/35/90
4.5×106
Dielectric Constant (10GHz) SPDR C-24/23/50 - 3.2
Dissipation Factor (10GHz) SPDR C-24/23/50
- 0.005
Folding Endurance JIS C-6471 R0.8×4.9N
Times >200
Flammability UL94 E-24/125 Rating VTM-0

Remarks:

1.Certified to IPC-4204/11 Copper Clad Adhesiveless

2.All the typical value listed above is for your reference only,please turn to Shengyi Technology Co., Ltd. for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.