CN/EN

产物与市场

ST115G

特色

● 散热性好

● 良好的保温、绝缘靠得住性

● 较低 Z-axis CTE., 高 CTI

● 无卤,Tg 175℃(DMA)

利用范畴

● PCB散热处置计划

● 汽车电子,LED前照灯

● 花费类电子产物(智能终端、SSD)


  • 产物机能
  • 产物证书
  • 资料下载
Items Method Condition Unit Typical Value
Thermal Conductivity ASTM-D5470 A W/ (m•K) 1.6

ASTM E1461 A
2.0
Tg 2.4.25D DSC 170
Td
2.4.24.6 Wt 5% loss 410
Thermal Stress 2.4.13.1 288℃, solder float min
>30
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 37
After Tg ppm/℃ 166
50-260℃ % 2.2
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ/cm 108
Surface Resistivity
2.5.17.1
C-96/35/90 107
Dielectric Breakdown 2.5.6 D-48/50+D-0.5/23 kV >45
Peel Strength (1oz) 2.4.8 288℃/10s N/mm 1.05
Flammability
UL94
C-48/23/50
Rating
V-0
Water Absorption IPC-TM-650 2.6.2.1
E-1/105+D-24/23 % 0.11
CTI IEC60112 A Rating PLC0

Remarks:

Remarks:

1. All the typical value is based onthe 1.0mm specimen, while the Tg is for specimen≥0.50mm.

2. All the typical values listed above arefor your reference only and not intended for specification. Please contactShengyi Technology Co., Ltd. for detailed information. All rights from thisdata sheet are reserved by Shengyi Technology Co., Ltd.

3. UL certificated Single/Double sidePCB min. thickness 0.38mm.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

Thefirst digit following the letter indicates the duration of preconditioning inhours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.