CN/EN

产物与市场

Synamic 6

特色

● 高Tg 205℃ (DMA)
● 低Dk/Df
● 更良好的耐热性,Td>400℃, T300>60min
● 更低的Z轴热收缩系数,优良的通孔靠得住性
● 更低的吸水率,优良的耐湿耐热性
● 兼容无铅制程

利用范畴

● 办事器、互换机、存储、路由器、基站BBU等

● 高频丈量仪器等

● 光通讯产物

  • 产物机能
  • 产物证书
  • 资料下载
Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 205
2.4.25D DSC
185
Td 2.4.24.6 5% wt. loss 402
T288
2.4.24.1 TMA min 120
T300 2.4.24.1
TMA min
60
Thermal Stress
2.4.13.1
288℃, solder dip
- PASS
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 50
After Tg ppm/℃ 210
50-260℃ % 2.0
Dissipation Constant
2.5.5.9 (1GHz)
C-24/23/50
- 3.70
2.5.5.5 (10GHz)
C-24/23/50
- 3.68
SPDR (10GHz)
C-24/23/50
- 3.99
Dissipation Factor
2.5.5.9 (1GHz)
C-24/23/50
- 0.0021
2.5.5.5 (10GHz)
C-24/23/50
- 0.0036
SPDR (10GHz)
C-24/23/50
- 0.0046
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm [lb/in] 0.85 [4.86]
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.09
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

1. All the typical value is based on 0.76mm (6*2116) thickness specimen.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.