CN/EN

产物与市场

S7045G

特色

● 高Tg>170℃ (DSC),无卤资料
● 低插损,Dk/Df @1GHz: 4.30/0.010
● 更低的Z轴热收缩系数,优良的通孔加工性

● 优良的耐CAF机能

● 利用RTF铜箔能取得更低的旌旗灯号消耗

利用范畴

● 办事器、互换机、路由器、基站、背板和线卡
  • 产物机能
  • 产物证书
  • 资料下载
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 175
Tg IPC-TM-650 2.4.24.4
DMA
190
Td IPC-TM-650 2.4.24.6 5% wt. loss 390
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 40
After Tg ppm/℃ 210
50-260℃ % 2.3
T260 IPC-TM-650 2.4.24.1 TMA min >60
T288 IPC-TM-650 2.4.24.1 TMA min >60
Thermal Stress
IPC-TM-650 2.4.13.1
288℃, solder dip
-- PASS
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1GHz -- 4.30
IPC-TM-650 2.5.5.5
10GHz
-- 4.15
IEC 61189-2-721
10GHz -- 4.50
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1GHz -- 0.0100
IPC-TM-650 2.5.5.5
10GHz
-- 0.0130
IEC 61189-2-721
10GHz -- 0.0130
Peel Strength (1oz RTF copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.0
125℃ N/mm
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.12
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

Remarks:

1. All the typical value is based on 0.76mm (6*2116) thickness specimen, but not guarantee data.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.