CN/EN

产物与市场

S6015

特色

● 不含卤素,无玻纤加强资料,合用于惯例HDI建造工艺
不掉树脂粉,净化少
可与惯例FR-4.0半固化片媲美的保管期
较低的介电常数,有益于特征阻抗节制及进步旌旗灯号传输速率

利用范畴

合用于建造无卤化趋向的手持式电子产物,如手机、PDA、数码摄像机等
  • 产物机能
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Items Method Condition Unit Typical Value
Tg 2.4.25D DSC
145
Thermal Stress
2.4.13.1
288℃/20s
- pass
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 3.4
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.018
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 5 x 108
Surface Resistivity
2.5.17.1
C-96/35/90 5 x 109
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 1.2
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.