产物与市场
SH260
特色
● Tg＞250℃ (TMA), Td＞405℃ (5% loss, TGA), T300＞60min● 极低Z-热收缩系数[1.20% (50-260℃)]，优良的通孔靠得住性
● 高的低温模量坚持率和低温靠得住性
● 韧性树脂系统，不含MDA
● 无铅无卤兼容，合适RoHS/WEEE请求
● 合适IPC 4101D/40/41请求
利用范畴
● 老化挑选板
● 井下钻探
● 航空航天
● 其余有持久低温情况需要的PCB
- 产物机能
- 产物证书
- 资料下载
| Items | Method | Condition | Unit | Typical Value |
|---|---|---|---|---|
| Tg | 2.4.24 | TMA | ℃ | ＞250 |
| Td | 2.4.24.6 | 5% wt. loss | ℃ | 429 |
| T300 |
2.4.24.1 |
TMA |
min |
＞60 |
| CTE (Z-axis) | 2.4.24 | 50-260℃ (X/Y) | ppm/℃ | 12~15 |
| α1 (before Tg) | ppm/℃ | 45 | ||
| 50-260℃ | % | 1.20 | ||
| Dissipation Constant (1GHz) | 2.5.5.9 | C-24/23/50 | - | 4.12 |
|
Dissipation Factor (1GHz) |
2.5.5.9 |
C-24/23/50 |
- | 0.007 |
| Volume Resistivity | 2.5.17.1 | C-96/35/90 | MΩ.cm | 7.45 x 107 |
|
Surface Resistivity |
2.5.17.1 |
C-96/35/90 | MΩ | 4.79 x 107 |
| Arc Resistance | 2.5.1 | D-48/50+D-0.5/23 | s | 180 |
| Dielectric Breakdown | 2.5.6 | D-48/50+D-0.5/23 | kV | 40.5 |
| Peel Strength (1Oz) | 2.4.8 | 288℃/10s | N/mm | 1.37 |
| Flexural Strength | 2.4.4 | A | MPa | 530 |
| Water Absorption | 2.6.2.1 | E-1/105+D-24/23 | % | 0.26 |
|
Flammability |
UL94 |
C-48/23/50 |
Rating |
HB |
Remarks:
1. Specimen thickness: 1.6mm. Test method is according to IPC-TM-650.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.