Items	Condition	Unit	Typical Value
Whiteness	Internal Standard	%	88
Tg	DMA	℃	181
Td	5% wt. loss	℃	374
T288	TMA	min	＞60
T260	TMA	min	＞60
Thermal Stress	288℃, solder dip	-	Pass
CTE (Z-axis)	Before Tg	ppm/℃	26.8
	After Tg	ppm/℃	123.7
	50-260℃	%	1.9
CTE (X/Y-axis)	Wrap-α1	ppm/℃	11-13
	Fill--α1	ppm/℃	11-13
Arc Resistance	D-48/50+D-0.5/23	s	180
Dielectric Breakdown	D-48/50+D-0.5/23	kV	45+kV NB
Peel Strength (1Oz)	288℃/10s	N/mm	0.93
Flexural Strength (LW/CW)	A	MPa	480/370
Water Absorption	E-1/105+D-24/23	%	0.08
Flammability	C-48/23/50	Rating	HB

Remarks:

1. Specimen thickness: 1.0mm. Test method is according to IPC TM-650.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.