产物与市场
SI643HU
特色
● Tg 245℃(DMA)● 低的XY轴/Z轴CTE及更高模量
● 优良的钻孔加工性
● 无卤素环保资料,合适无铅制程,合适RoHS/WEEE
利用范畴
● TF, UDP, SIM卡等
● LED RGB显现● 内嵌式存储
● RF/摄像头/指纹辨认模组
- 产物机能
- 产物证书
- 资料下载
Items | Condition | Unit | SI643HU | SI643U |
---|---|---|---|---|
Tg | DMA | ℃ | 245 | 230 |
Td | 5% wt. loss |
℃ |
409 | 400 |
CTE (Z-axis) | x/y-axis(α1) | ppm/℃ | ~10 | 12-13 |
(40-260℃), z-axis(α1/α2)1) |
ppm/℃ |
25/143 | 27/150 | |
Dielectric Constant (1GHz) |
- | - | 4.5 | 4.4 |
Dissipation Factor (1GHz) |
- | - | 0.007 | 0.007 |
Solder Dipping |
288 ℃ |
min |
>30 | >30 |
Peel Strength 1) |
1/3 Oz, VLP Copper Foil | N/mm | 0.73 | 0.8 |
Young’s modulus |
50℃ |
GPa | 25 | 22 |
200℃ | GPa | 22 | 15 | |
Flexural modulus1) |
50℃ | GPa | 28 | 26 |
200℃ | GPa | 18 | 16 | |
Water Absorption1) |
A | % | 0.17 | 0.2 |
85℃/85%Rh, 168Hr | % | 0.54 | 0.63 | |
Flammability |
UL-94 |
Rating |
V-0 |
V-0 |
Thermal Conductivity |
- | W/(m·K) | 0.61 | 0.58 |
Remarks:
All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.