利用范畴● Memory, CSP, BGA, POP类封装载板
|Tg||DMA||℃||270|| 270 |
|Td||5% wt. loss|| ℃ ||＞400||＞400|
| T300 ||TMA||min||＞60||＞60|
|CTE (X/Y-axis)||Before Tg|| ppm/℃ ||10||7|
|Dissipation Constant (1GHz)||184.108.40.206||-||4.6||4.2|
| Dissipation Factor (1GHz) ||220.127.116.11||-||0.006||0.006|
|Peel Strength||12 um LP|| N/mm ||0.8||0.8|
|Flexural Modulus||A|| GPa ||30||32|
|Water Absorption||C-168/85/85|| % ||0.35||0.35|
| Flammability ||UL-94|| Rating ||V-0||V-0|
|Heat Resistance||300℃/solder dip|| s ||＞300||＞300|
| Heat Resistance after Moisture absorption || PCT 5h+288℃solder 20s ||-||Pass||Pass|
| Halogen free ||-||-|| Yes ||Yes|
| Glass ||-||-||E glass||Low CTE-glass|
Remarks:1. These properties were measured with 0.80mm laminates except for XY-CTE that was measured with 0.10mm laminates.
2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.
Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning
The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.